april 2011 doc id 018753 rev 1 1/8 8 CPL-WB-00D3 wide band directional coupler with iso port features 50 nominal input / output impedance wide operating frequency range (824 mhz to 2170 mhz) low insertion loss (< 0.2 db) 34 db typical coupling factor high directivity (typical 25 db) high esd robustness (iec 61000-4-2 level 4) flip-chip package small footprint: 1300 x 1000 m benefits very low profile (< 690 m) lead-free package high rf performance rf module size reduction applications quad band power amplifier module quad band front end module gsm / wcdma mobile phone figure 1. pin configuration (top view) description the CPL-WB-00D3 is a wide band directional coupler designed to measure rf antenna output power in gsm / wcdma / td-scdma applications. this cpl has been customized for wide band operating frequencies (egsm and cell, pcs, dcs, td-scdma, wcdma band i) with less than 0.2 db in sertion losses in the transmit bandwidth (824 mhz to 2170 mhz). the CPL-WB-00D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non conductive glass substrate to optimize rf performance. the device is delivered 100% tested in tape and reel. b 1 2 3 a cpld rf in gnd gnd iso rf out atn. atn. www.st.com
characteristics CPL-WB-00D3 2/8 doc id 018753 rev 1 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power rf in 35 dbm v esd (iec) esd ratings iec 61000-4-2 (c = 150 pf, r = 330 , 10 shots with both polarities and each condition, cumulative method) iso and cpld pins connected to ground: rf in , rf out , air discharge rf in , rf out , contact discharge 15 8 kv kv v esd (hbm) human body model, jesd22-a114f, all i/o 2 kv v esd (mm) machine model, jesd22-a115-a, all i/o 100 v v esd (cdm) charge device model, jesd22-c101-c, all i/o 500 v t op operating temperature -30 +85 oc table 2. electrical characteristics (t amb = 25 c) - impedances symbol parameter value unit min. typ. max. z out nominal output impedance 50 z in nominal input impedance 50 z cpld nominal coupling impedance 50 z out nominal iso impedance 50 table 3. electrical characteristics (t amb = 25 c) - rf performance symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 824 2170 mhz i l insertion loss in bandwidth from 824 mhz to 2170 mhz 0.1 0.2 db r l return loss in bandwidth from 824 mhz to 2170 mhz 15 db cpld coupling factor (including attenuator) from 824 mhz to 915 mhz 35 39 db from 1710 mhz to 2025 mhz 28 33 db ripple coupling ripple in individual band (824 to 849 mhz) (880 to 915 mhz) (1710 to 1785 mhz) (1850 to 1910 mhz) (1880 to 2025 mhz) (1920 to 1980 mhz) 0.5 db dir coupler directivity from 824 mhz to 2025 mhz 20 25 db
CPL-WB-00D3 characteristics doc id 018753 rev 1 3/8 1.1 rf measurement (on reference evaluation board) measurements done on reference evaluation board under 50 , de-embedding at CPL-WB-00D3 bumps. figure 2. insertion loss figure 3. coupling and isolation figure 4. directivity 2170 2035 1901 1766 1632 1497 1362 1228 1093 959 824 -0.3 -0.25 -0.2 -0.15 -0.1 -0.05 -0.0 f (mhz) db -40 -26 db -28 -30 -32 -34 -36 -38 7.0e8 2.1e9 1.9e9 1.7e9 1.5e9 1.3e9 1.1e9 9.0e8 2.5e9 2.3e9 f (hz) 18 32 30 28 26 24 22 20 34 8.0e8 2.0e9 1.8e9 1.6e9 1.4e9 1.2e9 1.0e9 2.2e9 f (hz)
reference evaluation board CPL-WB-00D3 4/8 doc id 018753 rev 1 2 reference evaluation board figure 5. cpw lines (w = 127 m with gap to gnd = 100 m) on top layer + gnd on layer 2 material: 4 layers fr4 with solder mask on top and bottom layer substrate thickness: 0.8 mm line lengths: 14.3 mm trl cal kit available
CPL-WB-00D3 package information doc id 018753 rev 1 5/8 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 6. package dimensions (bump side) figure 7. footprint figure 8. marking 1.0 mm 50 m 630 m 60 m 1.3 mm 50m 450 m 595 m 255 m copper pad diameter: 220 m recommended, 260 m max solder stencil opening: 220 m solder mask opening : 320 m recommendation x y x w z w dot, st logo = ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week)
package information CPL-WB-00D3 6/8 doc id 018753 rev 1 figure 9. flip chip tape and reel specifications note: more information is availa ble in the application note: an1235: ?flip chip: package description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.1 0.22 1.4 st xxz yww st st xxz yww xxz yww
CPL-WB-00D3 ordering information doc id 018753 rev 1 7/8 4 ordering information 5 revision history table 4. ordering information order code marking base qty delivery mode CPL-WB-00D3 rx 5000 tape and reel table 5. document revision history date revision changes 21-apr-2010 1 initial release.
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